发明名称 MANUFACTURING METHOD FOR LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated electronic component that, when laminating an electrode pattern layer and a margin pattern layer formed so as to fill its clearance onto a thin-layered green sheet, can separate the laminated body unit intact from the support sheet and dispose of flections at the end of the internal electrode layer, thus decreasing a short circuit. SOLUTION: The manufacturing method for a laminated electronic component has a step of laminating an internal electrode pattern layer 12a, which makes an internal electrode layer 12 after calcination, and a margin pattern layer 24, adjusted to a complementary type pattern where the internal electrode pattern layer 12a is not formed, onto a green sheet 10a, which will make a dielectric layer 10 after calcination. An overlapping width C between an electrode printing pattern 51 designed to form an internal electrode pattern layer 12a by a printing method and a margin printing pattern 61 designed to form a margin pattern layer 24 by a printing method is set to be 5μm or more and 200μm or less. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007123758(A) 申请公布日期 2007.05.17
申请号 JP20050317281 申请日期 2005.10.31
申请人 TDK CORP 发明人 KAJIYAMA SHOHEI;KARATSU SHINKO;SATO SHIGEKI
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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