发明名称 |
SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD |
摘要 |
A substrate treatment apparatus is disclosed. The substrate treatment apparatus has an electrostatic chuck mechanism, a grounding mechanism, and an electron beam radiating mechanism. The electrostatic chuck mechanism electrostatically sucks and holds a substrate under treatment. The grounding mechanism freely contacts a predetermined film of a plurality of films formed on a treatment surface of the substrate under treatment sucked and held by the electrostatic chuck mechanism. The electron beam radiating mechanism radiates a resist film formed on the treatment surface side of the substrate under treatment with an electron beam.
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申请公布号 |
US2007111542(A1) |
申请公布日期 |
2007.05.17 |
申请号 |
US20060615676 |
申请日期 |
2006.12.22 |
申请人 |
E-BEAM CORPORATION |
发明人 |
SHINOZAKI HIROYUKI;YAMAGUCHI NORIHIRO;WATANABE KATSUHIDE |
分类号 |
B05C13/02;H01L21/20;H01L21/31 |
主分类号 |
B05C13/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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