发明名称 SUBSTRATE DRYING DEVICE AND SUBSTRATE PROCESSING METHOD
摘要 A substrate drying device according to an embodiment of the present invention includes: a nozzle ejecting a fluid to a substrate to be processed, wherein the substrate is moved relative to the nozzle while the nozzle is spraying the fluid to dry the substrate, a parallel component to a surface of the substrate in an ejection direction of the fluid is inclined with respect to a moving direction in which the substrate moves relative to the nozzle, and an angle between the parallel component and the moving direction is changed at a changed portion in a predetermined position of the nozzle.
申请公布号 US2007107253(A1) 申请公布日期 2007.05.17
申请号 US20060557263 申请日期 2006.11.07
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 NISHIURA ATSUNORI
分类号 B08B3/00;F26B3/00 主分类号 B08B3/00
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