| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition being excellent in flatness after development, sensitivity, resolution, heat resistance, transparency, and the like; capable of reducing its electric power consumption, especially by realizing an organic insulation film having a low dielectric constant; capable of reducing crosstalk; and suitable for an organic insulation film in various display operations. <P>SOLUTION: The photosensitive resin composition comprises: (a) an acrylic copolymer in which are copolymerized (i) a specific silsesquixane polyhedron oligomer-containing unsaturated compound, (ii) an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride, or a mixture thereof, (iii) an epoxy group-containing unsaturated compound and (iv) an olefinic unsaturated compound; (b) a 1,2-quinone diazide compound; and (c) a solvent. <P>COPYRIGHT: (C)2007,JPO&INPIT |
