ULTRASONIC BONDING FIXTURE

摘要

PROBLEM TO BE SOLVED: To provide a ultrasonic bonding fixture capable of efficiently and easily connecting a conductive member to an electrode of a semiconductor device using ultrasonic.

SOLUTION: An ultrasonic-bond fixture 15 which directly ultrasonic-bonds a conductive current path member 6 to an electrode member 4 formed in an upper surface of a semiconductor device 5 has: a contact end surface 15a for contacting the current path member 6 to give supersonic vibration to the current path member 6; and a suction hole 16 for sucking the current path member 6 to support the current path member 6 against the contact end surface 15a.

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