发明名称 |
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, LIQUID CRYSTAL DISPLAY DEVICE, RFID TAG, LIGHT EMITTING DEVICE, AND ELECTRONIC DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, in which characteristics of the semiconductor device are improved by thinning a gate insulating film and a leakage current can be reduced, and a manufacturing method thereof. SOLUTION: An aluminum film 121a which is a metal film is formed on a polycrystalline semiconductor film 103a, and plasma oxidizing treatment is performed to the aluminum film, whereby an aluminum oxide film 104 is formed by oxidizing the aluminum film, and a silicon oxide film 100a is formed between the polycrystalline semiconductor film 103a and the aluminum oxide film. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007123849(A) |
申请公布日期 |
2007.05.17 |
申请号 |
JP20060257064 |
申请日期 |
2006.09.22 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
KAKEHATA TETSUYA |
分类号 |
H01L21/336;G02F1/1368;H01L21/20;H01L21/283;H01L29/423;H01L29/49;H01L29/786;H01L51/50 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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