| 摘要 |
PROBLEM TO BE SOLVED: To provide a ball loading apparatus capable of shortening the time needed to load one ball on a substrate, and of improving position accuracy of loading the ball. SOLUTION: The ball loading apparatus 1 comprises a substrate support mechanism 62 movable horizontally for supporting a semiconductor wafer 9; a ball supply tray 21 capable of supporting a plurality of conductive balls B; a head 11 for placing, by sucking the conductive ball B from the ball supply tray 21, it on a loading surface 9a of the semiconductor wafer 9; a moving mechanism 19 for moving the head 11 vertically; and a moving mechanism 29 for moving a ball supply tray 21 horizontally between the head 11 and the substrate support mechanism 62. COPYRIGHT: (C)2007,JPO&INPIT
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