| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device which improves the heat dissipation of a heated integrated circuit device. SOLUTION: An electronic device 100 mounted in a mounting board J comprises: a piezoelectric oscillating circuit 20; an integrated circuit element 30 for constituting an oscillating circuit; and a container body 10 composed of two frames 12 and 13 for forming two cavities K1 and K2 which accommodate individually the piezoelectric oscillating element 20 and the integrated circuit element 30, a substrate 11 put in-between by these two frames 12 and 13, and a lid 14 for sealing the one of the cavity formed by the frame 12. When the container 10 is mounted in the mounting substrate J, the rear surface opposite to an electrode formation side of the integrated circuit element 30 is characteristically brought into contact with the mounting substrate J. COPYRIGHT: (C)2007,JPO&INPIT
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