| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which inhibits the whitening caused in the acid resistance test and can make the visibility of laser marking clear in the case of using the epoxy resin composition containing a metal hydroxide as a flame-retardant as a sealing medium for a semiconductor device and the like, and a semiconductor device sealed therewith. SOLUTION: The epoxy resin composition comprising an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, a metal hydroxide, and an azine dye is used. COPYRIGHT: (C)2007,JPO&INPIT
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