| 摘要 |
A liquid cooling module includes a heat-absorbing unit, a heat-dissipating unit, a outlet pipe and a inlet pipe. The heat-dissipating unit includes a tank configured for receiving a coolant therein, a pump disposed in the tank, at least one thermoelectric device and at least one heat sink. The thermoelectric device has a first surface and a second surface facing away the first surface, the first surface thereof is attached to the tank. The heat sink is attached to the second surface of the thermoelectric device. The outlet pipe interconnects the heat-absorbing unit and the pump. The inlet pipe interconnects the tank and the heat-absorbing unit. The liquid cooling module has a small volume, and can be easily disposed in a computer enclosure.
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