| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a soldering method and apparatus which can attain a highly reliable soldering. <P>SOLUTION: This soldering method, by which joining pads formed in each workpiece are soldered with each other, comprises: a pad heating process in which a heating beam is emitted so that each joining pad is heated before a solder is fused in a state disposed on the irradiation route of the heating beam; and a solder fusing process in which the solder is fused by the heating beam and adhered onto each joining pad. The irradiation of the heating beam is performed roughly simultaneously for the pad heating process and the solder fusing process. Thereafter, there is additionally a fused solder heating process in which the solder fused on the joining pad is further heated by the heating beam. <P>COPYRIGHT: (C)2007,JPO&INPIT |
