| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for polishing a substrate at a high speed without scratching the surface polished of an SiO<SB>2</SB>insulating film, or the like. <P>SOLUTION: In the method for polishing a substrate by using abrasive powder containing slurry produced by dispersing cerium oxide grains composed of two or more crystallites and containing cerium oxide grains having a grain boundary into a medium, a new surface is created by destroying the grain boundary of cerium oxide grains with stress during polishing. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
