| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing epoxy resin composition which has good fluidity and curability in seal forming and has such good soldering resistance that no cracks are formed even in soldering at high temperatures coping with soldering with lead-free solder. SOLUTION: Provided are a semiconductor sealing epoxy resin composition which is an epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) an inorganic filler, (D) a cure accelerator, and (E) a coupling agent, wherein the cure accelerator (D) contains a cure accelerator (d1) having a cationic moiety and an anionic silicate moiety, and the coupling agent (E) comprises a secondary-amino-containing silane coupling agent (e1), and a semiconductor device prepared by sealing a semiconductor element therewith. COPYRIGHT: (C)2007,JPO&INPIT
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