| 摘要 |
A semiconductor wafer, a panel, and an electronic component, and also methods for producing them is disclosed. In this context, the electronic component has a stack of two semiconductor chips. The top stacked semiconductor chip is thin-ground and is arranged using flip-chip technology on a central regions of the bottom semiconductor chip. An edge region of the bottom semiconductor chip contains vias through a leveling layer to a rewiring plane, which for its part carries external contacts. |
