| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is thin, and even when stacked, is compact and is able to increase in number terminal. <P>SOLUTION: The semiconductor device is composed of a plurality of semiconductor packages 1, each comprising a wiring substrate 5 having a hole in its central part, a semiconductor chip 2 arranged in the hole of the wiring substrate 5, connection terminals 6 arranged on the wiring substrate 5 and connected to the semiconductor chip 2 via lead wires 4, and upper connection terminals 9 and lower connection terminals 8 connected to the connection terminals 6 while being prepared in top view and lower surface in exterior of hole of wiring plate 5. A molding part 7 for protecting the semiconductor chip 2, lead wires 4, and the connection terminals 6 is arranged in the hole of the wiring substrate 5, wherein the upper surface of the molding part 7 does not exceed the upper surface of the wiring substrate 5 outside the hole. Since the pads facing between stacked semiconductor packages 1 are connected by solder members, space is provided around the solder members and between the sacked semiconductor packages. <P>COPYRIGHT: (C)2007,JPO&INPIT |
