| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a reliable laminated semiconductor device by facilitating inspection including a connection terminal in the laminated semiconductor device. <P>SOLUTION: The lower-layer module of the laminated semiconductor device comprises a first substrate 11, and a first semiconductor chip 21 held on the first substrate 11. On the upper surface of the first substrate 11; a plurality of first chip connection terminals 13 electrically connected to a first chip terminal 22, respectively, and a plurality of upper-layer module connection terminals 14 that can be electrically connected to an upper-layer module having a second semiconductor chip, respectively, are provided. On the backside of the first substrate 11, a plurality of external substrate connection terminals 15 are provided. Each first chip connection terminal 13 is electrically connected to a predetermined external substrate connection terminal 15, and each upper-layer module connection terminal 14 is electrically connected between the predetermined chip connection terminal 13 and the predetermined external substrate connection terminal 14. <P>COPYRIGHT: (C)2007,JPO&INPIT |
