| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a "seal tag inlet" which has such a simplified inexpensive structure that an IC chip will not project from its periphery and ruggedness is less likely to form at an IC chip part of a substrate, and which can be used at high degrees of freedom. <P>SOLUTION: The "seal tag inlet" has the substrate 12; an antenna 14 arranged on the substrate 12; the IC chip 11 arranged on the substrate 12 and flip-chip packaged to the antenna 14; and an intermediate adhesion layer 13 and an intermediate seat material 15, each being provided with a through hole 18 into which the IC chip 11 is inserted, where the adhesion layer 13 and the intermediate seat material 15 are arranged on the substrate 12, in this order, and jointed together and hot melt is used as the jointing means. The seal tag inlet is characterized in that the sum of the thickness of the intermediate adhesion layer 13 having been jointed, and the thickness of the intermediate seal material 15 having been jointed is not smaller than than the maximum thickness of the IC chip 11. <P>COPYRIGHT: (C)2007,JPO&INPIT |
