| 摘要 |
PROBLEM TO BE SOLVED: To suppress the generation of a void at the time of lamination in a multilayer printed wiring board. SOLUTION: In the structure of a multilayer printed wiring board; a conductive wiring layer 3 that becomes an inner layer is formed, an area which is in the same layer as the conductive wiring layer 3 and in which conductive wiring is not formed at least is filled with a resin 5, the resin 5 is polished, and then an adhesive resin layer is laminated on a polished surface. In such a structure of the multilayer printed wiring board, a dummy conductive layer 4 is formed in the area which is in the same layer as the conductive wiring layer 3 and in which conductive wiring is not formed. COPYRIGHT: (C)2007,JPO&INPIT |
