INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DOWNSET LEAD
摘要
An integrated circuit package system includes an integrated circuit package having a downset terminal lead, a planar recessed lead surface of the downset terminal lead, and an attached integrated circuit over the planar recessed lead surface.
申请公布号
US2007108624(A1)
申请公布日期
2007.05.17
申请号
US20060381734
申请日期
2006.05.04
申请人
STATS CHIPPAC LTD.
发明人
PUNZALAN JEFFREY D.;ALVAREZ SHEILA M.L.;CAPARAS JOSE A.;QUIAZON ROBINSON
