| 摘要 |
Embodiments of the present invention define a modular architecture that provides the physical level of interconnect that is used to cost effectively deploy high performance and high flexibility communication networks. Aspects of the physical communications are described to deliver scalable computer to computer communications as well as scalable computer to I/O communications, scalable I/O to I/O communications, and scalable function to function communications with a low cable count. Embodiments of the present invention focus on the physical switched communications layer, as the interconnect physical layer, functions, chassis; modules have been designed as an integrated solution.
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