发明名称 INTEGRATED CIRCUIT SYSTEM WITH WAFER TRIMMING
摘要 An integrated circuit system includes an integrated circuit wafer, forming a trimmed edge on the integrated circuit wafer, and applying a thinning process on the integrated circuit wafer with the trimmed edge.
申请公布号 US2007108557(A1) 申请公布日期 2007.05.17
申请号 US20060532455 申请日期 2006.09.15
申请人 STATS CHIPPAC LTD. 发明人 PARK SEUNG WOOK;LEE TAEWOO;LEE SUNG YOON
分类号 H01L29/06 主分类号 H01L29/06
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