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发明名称
INTEGRATED CIRCUIT SYSTEM WITH WAFER TRIMMING
摘要
An integrated circuit system includes an integrated circuit wafer, forming a trimmed edge on the integrated circuit wafer, and applying a thinning process on the integrated circuit wafer with the trimmed edge.
申请公布号
US2007108557(A1)
申请公布日期
2007.05.17
申请号
US20060532455
申请日期
2006.09.15
申请人
STATS CHIPPAC LTD.
发明人
PARK SEUNG WOOK;LEE TAEWOO;LEE SUNG YOON
分类号
H01L29/06
主分类号
H01L29/06
代理机构
代理人
主权项
地址
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