| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a BGA type package mounting structure which can prevent damage to a soldering ball caused by an external force. <P>SOLUTION: A fingerprint reader 5 has a fingerprint sensor 50 and a sensor mounting board 51, and the fingerprint sensor 50 and the sensor mounting board 51 are electrically connected with soldering balls 52. Supporting members 53 are inserted into an opening of the sensor mounting board 51 from its lower surface to be located so that the space between the top of the supporter 53A and the back of the fingerprint sensor 50 is d, and the supporting members 53 are fixed to the sensor mounting board 51 with an adhesive 53B. <P>COPYRIGHT: (C)2007,JPO&INPIT |
