发明名称 SUBSTRATE-TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate-treating device which accurately controls the flow rate of a treatment liquid supplied to a substrate. SOLUTION: The control unit of the substrate-treating device determines the operation procedures and operating conditions of a plurality of cleaning treatment sections 5a-5d, and also determines the amount of discharge of a boosting pump P1, based on a treatment recipe corresponding to the plurality of cleaning treatment sections 5a-5d in advance. The control unit determines the amount of discharge in the boosting pump P1, based on the treatment recipe before controlling the boosting pump P1 to perform the feedforward control of the amount of discharge in the boosting pump P1. For example, the control unit determines the amount of discharge in the boosting pump P1 in advance, based on the timing of the treatment of a medical solution and the discharge flow rate of a chemical solution nozzle set to the treatment recipe of the plurality of cleaning treatment sections 5a-2d. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007123393(A) 申请公布日期 2007.05.17
申请号 JP20050310992 申请日期 2005.10.26
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 KOUGAKI KOUICHI;TAJIMA MITSUHIKO
分类号 H01L21/304;B08B3/02 主分类号 H01L21/304
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