发明名称 |
Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, process for manufacturing printed circuit board and method for removing photocured product |
摘要 |
The photosensitive resin composition of the invention comprises (A) a photopolymerizing compound with two or more ethylenic unsaturated bonds in the molecule and (B) a photopolymerization initiator which initiates photopolymerization reaction of the (A) photopolymerizing compound, the photosensitive resin composition being characterized in that the molecule of the (A) photopolymerizing compound further contains a characteristic group with a bond which breaks when the (A) photopolymerizing compound is heated under temperature conditions of 130-250° C.
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申请公布号 |
US2007111136(A1) |
申请公布日期 |
2007.05.17 |
申请号 |
US20040569734 |
申请日期 |
2004.08.25 |
申请人 |
MIYASAKA MASAHIRO;ITO TOSHIKI |
发明人 |
MIYASAKA MASAHIRO;ITO TOSHIKI |
分类号 |
G03C1/00;G03F7/027;G03F7/42;H05K3/00 |
主分类号 |
G03C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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