发明名称 PROCESSING METHOD OF LAMINATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a processing method of a laminate capable of simply cutting/dividing the laminate even if the materials of the substrates which constitute the laminate are different. <P>SOLUTION: In the processing method of the laminate P, the laminate P is constituted of a plurality of substrates and composed of a substrate P1 being a first substrate and a substrate P2 being the second substrate laminated on the substrate P1. This processing method of the laminate P is equipped with a process for irradiating the substrate P1 with a laser beam 5 to form a material modified part 7 and a process for applying stress F to the laminate P to form divided pieces Q. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007118207(A) 申请公布日期 2007.05.17
申请号 JP20050309432 申请日期 2005.10.25
申请人 SEIKO EPSON CORP 发明人 YAMAZAKI YUTAKA;UMETSU KAZUNARI;KUROKI YASUNOBU
分类号 B28D5/00;B23K26/38;B23K26/40 主分类号 B28D5/00
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