发明名称 |
PROCESSING METHOD OF LAMINATE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a processing method of a laminate capable of simply cutting/dividing the laminate even if the materials of the substrates which constitute the laminate are different. <P>SOLUTION: In the processing method of the laminate P, the laminate P is constituted of a plurality of substrates and composed of a substrate P1 being a first substrate and a substrate P2 being the second substrate laminated on the substrate P1. This processing method of the laminate P is equipped with a process for irradiating the substrate P1 with a laser beam 5 to form a material modified part 7 and a process for applying stress F to the laminate P to form divided pieces Q. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
申请公布号 |
JP2007118207(A) |
申请公布日期 |
2007.05.17 |
申请号 |
JP20050309432 |
申请日期 |
2005.10.25 |
申请人 |
SEIKO EPSON CORP |
发明人 |
YAMAZAKI YUTAKA;UMETSU KAZUNARI;KUROKI YASUNOBU |
分类号 |
B28D5/00;B23K26/38;B23K26/40 |
主分类号 |
B28D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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