| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method with less damage such as a pattern peel-off when performing a processing of removing a residual substance such as a sacrifice film after etching a film to be etched, by solubilizing this residual substance in a prescribed liquid and subsequently removing the residual substance by this prescribed liquid. SOLUTION: The substrate processing method comprises steps of forming a prescribed pattern by etching a film to be etched formed on a substrate; denaturing a substance remained after ending etching processing so as to be soluble in a prescribed liquid; subsequently silylating a surface of the film to be etched on which a pattern is formed; and thereafter dissolving and removing the substance denatured by supplying the prescribed liquid. COPYRIGHT: (C)2007,JPO&INPIT
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