发明名称 In-situ plasma treatment of advanced resists in fine pattern definition
摘要 A novel, in-situ plasma treatment method for eliminating or reducing striations caused by standing waves in a photoresist mask, is disclosed. The method includes providing a photoresist mask on a BARC (bottom anti-reflective coating) layer that is deposited on a feature layer to be etched, etching the BARC layer and the underlying feature layer according to the pattern defined by the photoresist mask, and subjecting the photoresist mask to a typically argon or hydrogen bromide plasma before, after, or both before and after etching of the BARC layer prior to etching of the feature layer. Preferably, the photoresist mask is subjected to the plasma both before and after etching of the BARC layer.
申请公布号 US2007111110(A1) 申请公布日期 2007.05.17
申请号 US20050274109 申请日期 2005.11.14
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 LIN LI-TE;WANG YUI;LIN HUAN-JUST;CHIU YUAN-HUNG;TAO HUN-JAN
分类号 G03F1/00;C03C15/00;G03C5/00 主分类号 G03F1/00
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