| 摘要 |
On the peripheral edge of a front side substrate of an FED, a rectangular frame shaped sealing surface is formed for sealing a sidewall. On the sealing surface, an indium layer is formed through a base layer. At the four corners of the indium layer, an electrode for applying an electric current is connected. The indium layer is formed to have a width gradually decreasing from substantially the center of each side of the sealing surface to adjacent corners.
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