发明名称 SUBSTRATE IN WHICH CAPACITOR IS BUILT AND METHOD OF MANUFACTURING SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To build a capacitor of large capacitance and high reliability in a substrate with high mass productivity. <P>SOLUTION: A method of manufacturing the substrate in which the capacitor is built includes a step of forming a first conductor pattern 12 for one of the electrodes of the capacitor on a substrate 11 for pattern transfer, a step of transferring the first conductor pattern so as to embed itself into an insulating member 13 to form a first substrate member, a step of forming a second conductor pattern 22 for the other of the electrodes of the capacitor on a substrate for pattern transfer, a step of transferring the second conductor pattern so as to embed itself into an insulating member 23 to form a second substrate member, a step of arranging a dielectric layer 14a on the surface of the embedded side of the conductor pattern of either the first or the second substrate member, and a step of pressing the first and the second substrate members to integrate them together. The dielectric layer is formed by vacuum-laminating dielectric sheets formed by mixing a filler into a resin. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007123940(A) 申请公布日期 2007.05.17
申请号 JP20070018579 申请日期 2007.01.29
申请人 TDK CORP 发明人 KAJINO TAKASHI;SASAKI MASAMI;OZAKI YUMIKO
分类号 H05K1/16;H01L23/12;H05K3/20;H05K3/46 主分类号 H05K1/16
代理机构 代理人
主权项
地址