| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor module with which a semiconductor chip can be bonded to a wiring board in a simple mounting process. SOLUTION: In the manufacturing method of the semiconductor module 100, the semiconductor chip 70 having a cathode electrode 60 and an anode electrode 54 is bonded to the wiring board having a first wiring part 12 and a second wiring 14 with wireless bonding. The method comprises (a) a process for arranging the reference position of the semiconductor chip 70 on the reference position of the wiring board, for bonding the cathode electrode 60 to the second wiring 14 and the anode electrode 54 to the first wiring 12; and (b) a process for irradiating laser spots 80, 82 and 84 arranged in a line with laser beams, bonding the cathode electrode 60 to the second wiring 14, and bonding the anode electrode 54 to the first wiring 12 in the first wiring 12 and the second wiring 14. COPYRIGHT: (C)2007,JPO&INPIT
|
