| 摘要 |
PROBLEM TO BE SOLVED: To provide a phenolic resin composition excellent in the balance of cure rate and heat resistance and preventing curing inhibition even in blending of basic fillers by using substantially no hexamethylenetetramine. SOLUTION: The phenolic resin composition comprises a novolak-type phenolic resin (a), a polyacetal resin (b) and an organic base compound (c) as essential components and comprises substantially no hexamethylenetetramine. Preferably, the organic base compound (c) contains phosphorus and/or nitrogen and further contains a compound having a boiling point of 150°C or higher. COPYRIGHT: (C)2007,JPO&INPIT
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