发明名称 Switch pin for SMD manufacturing processes
摘要 A switch pin for SMD manufacturing processes to be mounted onto a circuit board includes a connection end located in a switch and a coupling end extended from the connection end and exposed outside the switch. The coupling end has a horizontal portion and a bend portion bending from the horizontal end towards the switch. Hence the signal pin and the circuit board can form a greater electric connection area to enhance electric effect of the switch. The bend portion also can prevent interference of other electronic elements installed on the circuit board.
申请公布号 US2007108031(A1) 申请公布日期 2007.05.17
申请号 US20050272692 申请日期 2005.11.15
申请人 ZIPPY TECHNOLOGY CORP. 发明人 SU TSUI-JUNG
分类号 H01H5/30 主分类号 H01H5/30
代理机构 代理人
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