发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor light emitting element capable of easily and accurately forming a minute irregular structure of the semiconductor light emitting element having the minute irregular structure of an arbitrary shape on a light exit face side. <P>SOLUTION: The semiconductor light emitting element 1 includes a light emitter 12 on one surface side of a sapphire substrate 10 and a minute irregular structure 11 on the other surface side, the light exit face side. The method of manufacturing the semiconductor light emitting element comprises: a resist layer forming process of forming an organic material resist layer 30 on the other surface side of the sapphire substrate 10; a transfer process of transferring an irregular pattern 51 to the resist layer 30 using a mold material 50, on which there is formed an irregular pattern 51 designed in accordance with the minute irregular structure 11; and a pattern forming process of forming the minute irregular structure 11 on the other surface side of the sapphire substrate 10. As the foregoing organic material a novolac-based resin is used, and in the pattern forming process the resist layer 30 and the sapphire substrate 10 are etched by anisotropic dry etching using chlorine-based gas. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007123446(A) 申请公布日期 2007.05.17
申请号 JP20050311969 申请日期 2005.10.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 MASUI MIKIO;FUKUSHIMA HIROSHI
分类号 H01L33/22;H01L33/32 主分类号 H01L33/22
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