SUBSTRATE MATERIAL FOR PRINTED BOARD AND PRINTED BOARD

摘要

PROBLEM TO BE SOLVED: To provide a substrate material for a printed board and a printed board superior in a soldering heat resistance and suppressing a communication loss low by suppressing a rise of a dielectric loss factor accompanying a rise of a frequency band width. SOLUTION: The printed board 1 has a metal foil 4 for forming a given conductor pattern on at least one side of a substrate material 2 made by keeping a non-woven fabric made from a polyarylate-based liquid crystalline polymer applied by a heat treatment impregnated or overlaid with a fluororesin. A fluororesin adhesive layer 3 is formed between the substrate material 2 described before and the metal foil 4 described before. COPYRIGHT: (C)2007,JPO&INPIT