| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin filling structure capable of immediately radiating heat caused by heating a semiconductor component in a piezoelectric oscillator that is an electronic component coating the inside of a cavity with a resin for molding the semiconductor component in a container 1 including a cavity for housing the semiconductor component 37 to be flip-chip mounted. SOLUTION: In a piezoelectric oscillator that is an electronic component filling the inside of a cavity 20 with a first resin 38 and a second resin 39 coating the first resin 38 for molding the semiconductor component 37 in the container 1 including a cavity 20 for housing the semiconductor component 37 to be flip-chip mounted, the semiconductor component 37 is surrounded with the first resin 38, and the inside of the cavity 20 is fully filled with a resin material of which heat conduction efficiency is higher than that of the first resin, so as to cover the first resin 38 with the second resin 39. COPYRIGHT: (C)2007,JPO&INPIT
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