| 摘要 |
PROBLEM TO BE SOLVED: To obtain the terminal structure of a chip-like electronic part capable of inhibiting the intrusion of sulfurization generative factor from insulating resin layers in the vicinity of peaks of protrusions in an electronic device formation layer. SOLUTION: A metal glaze-based surface electrode 103 containing silver is provided on the surface of an insulating ceramic substrate 101. A resistor layer 107 is provided on the surface of the substrate by being electrically connected to the surface electrode 103. A glass layer 109a is provided for entirely covering, the surface of the resistor layer 107 including the surfaces of both ends, and partially covering the surface electrode 103. The insulating resin layer 109b is provided for covering the surface of the glass layer 109a including at least the surfaces of the ends and covering a part of the surface electrode 103. COPYRIGHT: (C)2007,JPO&INPIT
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