SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing the deterioration of reliability in a connecting section due to warps generated in two semiconductor packages when the semiconductor packages are connected through a solder ball. SOLUTION: In the semiconductor device, the two semiconductor packages 6 and 16 arranging semiconductor elements 3 and 13 on the surfaces of wiring boards 1 and 11 respectively are laminated through solder balls 18 arranged among a plurality of the mutual connecting electrodes 4 and 14, in upper and lower sections formed to the opposed surfaces of each wiring board respectively. In the semiconductor device, recesses 4b are formed to the lower connecting electrodes 4B in an external row disposed to namely one wiring board 1 at a place where a distance (an opening) between both wiring boards is shortened due to the warps of the wiring boards when both wiring boards are laminated mutually. COPYRIGHT: (C)2007,JPO&INPIT