发明名称 |
Separating device for separating semiconductor substrate and method for separating the same |
摘要 |
A separating device for separating a semiconductor substrate includes: a cutting element for cutting the semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate; an adsorbing element for adsorbing a dust on a surface of the semiconductor substrate by using electrostatic force; and a static electricity generating element for generating static electricity and for controlling the static electricity in order to remove the dust from the adsorbing element. |
申请公布号 |
US2007111476(A1) |
申请公布日期 |
2007.05.17 |
申请号 |
US20060591496 |
申请日期 |
2006.11.02 |
申请人 |
DENSO CORPORATION |
发明人 |
SUGIURA KAZUHIKO;YOKOYAMA KENICHI;TAMURA MUNEO;FUJII TETSUO;ASAI MAKOTO |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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