| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrochemical and mechanical polishing method of a substrate. <P>SOLUTION: A method and an apparatus for controlling voltage mode current are provided. The method implemented by a computer includes steps of: (a) starting an ECMP polishing process on a conductive film of a substrate; (b) setting current output voltage of a voltage source to set the current output voltage based on a recipe for the ECMP polishing process; (c) measuring the current flowing in the conductive film; (d) calculating a current polishing rate based on the measured current; (e) determining whether adjustment for the current output voltage is necessary for making determination, based on a target polishing rate; and (f) calculating and effecting the adjustment for the current output voltage when the adjustment is determined to be needed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
