SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a method for lowering a contact resistance by enlarging a contact area with a contact even in the projected semiconductor layer having a small cross-sectional area. SOLUTION: The semiconductor device comprises a projected semiconductor layer formed on a semiconductor substrate, and a contact area which is in contact with a ceiling surface of the projected semiconductor layer and a part of the side wall thereof and is electrically connected to the projected semiconductor layer. COPYRIGHT: (C)2007,JPO&INPIT