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发明名称
SEMICONDUCTOR WAFER WITH GROOVE FOR CRACK PREVENTION AND METHOD FOR DICING THE SAME
摘要
申请公布号
KR20070051088(A)
申请公布日期
2007.05.17
申请号
KR20050108521
申请日期
2005.11.14
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
EUN, HYUNG LAE
分类号
H01L21/301
主分类号
H01L21/301
代理机构
代理人
主权项
地址
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