首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
METHOD FOR TESTING STAND-BY CURRENT OF SEMICONDUCTOR PACKAGE
摘要
申请公布号
KR20060084272(A)
申请公布日期
2006.07.24
申请号
KR20050005071
申请日期
2005.01.19
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
SIM, MOON BO;KWAK, JOO SEOK;KIM, SEONG SU;YANG, YUN BO;KIM, SUN KI
分类号
G01R19/165
主分类号
G01R19/165
代理机构
代理人
主权项
地址
您可能感兴趣的专利
DISAZO COMPOUND AND DYEING OF SUBSTRATE USING SAID COMPOUND
ACRYLIC RESIN COMPOSITION
HALOGEN-CONTAINING POLYCARBOSILANE AND REDUCTION OF HALOGEN CONTENT OF POLYSILANE
POLYESTER
THERMOSETTING RESIN COMPOSITION
PRODUCTION OF EPOXY RESIN REDUCED IN CONTENT OF UNDERSIRED HALOGEN
MOISTURE-CURING ADHESIVE
HIGH POLYMER PIEZOELECTRIC MATERIAL AND PRODUCTION THEREOF
OIL-EXTENDED POLYCHLOROPRENE HAVING EXCELLENT FATIGUE RESISTANCE
QUINOLONE AS ANTIFUNGAL
PRODUCTION OF 1,4(3,4)-DIHYDROPYRIMIDINE DERIVATIVE
QUICK CURING AGENT AND ACCELERATOR FOR EPOXY RESIN
MANUFACTURE OF N-ALKYLCAPROLACTAM
POLYMER BONDED OXIDATION INHIBITING STABILIZER
POLYSACCHARIDE, ISOLATION AND USE THEREOF
NOVEL CONDENSATED DIAZEPINONE, MANUFACTURE AND MEDICINAL COMPOSITION
2-PHENYLPYRIDINE DERIVATIVE
PHENOLIC ANTIOXIDANT HYDRAZIDE
IN-PILE BRAZING METHOD CONTAINING NO FLUX
COATING MATERIAL FOR CASTING MOLD