| 摘要 |
A process for manufacturing an IC card includes a step of forming a plane coil (12) by etching or punching a thin metal plate so that the plane coil (12) consists of a conductor line (2) wound as several loops in substantially the same plane and has respective terminals (32). A semiconductor element (28) having electrodes (30) is mounted on the plane coil (12). An adhesive agent or tape (36) is attached to a predetermined area of the plane coil (12) so that adjacent conductor lines (2) in the loops have a predetermined gap therebetween. The plane coil (12) is disposed between a pair of films to cover the plane coil (12) therebetween, one of the films being provided with adhesive layer on a surface facing to the other film to seal the plane coil with the semiconductor element (28) by attaching the pair of films with respect to each other by means of the adhesive layer. <IMAGE>
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