Adhesive sheet for manufacturing semiconductor device, semiconductor device using the same and method of manufaturing thereof

摘要

PURPOSE: An adhesive sheet for fabricating a semiconductor device is provided to avoid a wire bonding defect, a mold flash and residual paste by fabricating a semiconductor device like QFN(quad flat non-leaded) while using an adhesive sheet. CONSTITUTION: An adhesive sheet for fabricating a semiconductor device is detachably attached to a leadframe(20) or an interconnection substrate. The adhesive sheet has a stacked body including a heat-resistant base material and an adhesive layer. The adhesive layer contains a thermoplastic resin component and a re-peeling property giving component. The adhesive layer contains a thermosetting resin component.