| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce or prevent deterioration and damage of an electronic device onto which an IC card is mounted. <P>SOLUTION: On a periphery of a memory card 1A, whose part of the outline is formed without having a cap by a sealing part 2c made of thermosetting resin formed by transfer mold, a buffer 3 is provided. The buffer 3 has a tapered outer corner and a softer and smoother surface than the sealing part 2c. When the memory card 1A is mounted on the electronic device, the buffer 3 has contact with, connector pins and guide rails of the connectors, thereby reducing or preventing the deterioration and damage of the connectors. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
