| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component superior in heat dissipation, and a method for manufacturing it. SOLUTION: A metal protrusion 20 is formed on the rear surface 10b of a substrate 10A of an electronic element 10, and a metal film 22 is formed above the metal protrusion 20 to cover the metal protrusion 20 with the metal film 22. The metal film 22 is brought into contact with semi-cylindrical conductive parts formed on end surfaces of side walls 11b1 and 11b2 of a box body 11 to electrically be connected to a connection 18 through the semi-cylindrical conductive parts and conductive parts 16 and 17. By employing such a way, Joule heat generated from the electronic element 10 is transferred to the metal film 22, and then transferred to a wiring board 23 through the connection 18, so that the heat can be dissipated from the wiring board 23, too. COPYRIGHT: (C)2006,JPO&NCIPI |
