发明名称 |
Thermally-formable and cross-linkable precursor of a thermally conductive material |
摘要 |
The invention relates to a thermally-formable and cross-linkable precursor of a thermally-conductive material comprising a) one or more crosslinkable polymers where the melt flow index of the polymer or mixture of polymers (measured at 190° C. according to ASTM D-1238), respectively, is 10-100 g/10 min and b) one or more thermally-conductive fillers in an amount of at least 60 wt. % of the total weight of the precursor.
|
申请公布号 |
US2006099338(A1) |
申请公布日期 |
2006.05.11 |
申请号 |
US20050540630 |
申请日期 |
2005.06.23 |
申请人 |
BOELZ UWE;WEBER PETER;REIMANN STEFAN R |
发明人 |
BOELZ UWE;WEBER PETER;REIMANN STEFAN R. |
分类号 |
B05D5/10 |
主分类号 |
B05D5/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|