Semiconductor package with conductive molding compound and manufacturing method thereof

摘要

The present invention relates to a semiconductor package having a conductive molding compound to prevent static charge accumulation. By using a conductive molding compound heat conductivity is also increased and heat generated by the semiconductor chip is more effectively dissipated externally. Additionally, the conductive compound blocks electromagnetic waves making possible an optimal semiconductor package satisfying the electromagnetic compatibility (EMC) and increasing the reliability of the semiconductor chip especially when processing high-speed signals.