发明名称 NANOTUBE-BASED FLUID INTERFACE MATERIAL AND APPROACH
摘要 <p>A thermal interface material (130) facilitates heat transfer between an integrated circuit device (120) and a thermally conductive device (140). According to an example embodiment, a thermal interface material (130) includes carbon nanotube material that enhances the thermal conductivity thereof. The interface material (130) flows between an integrated circuit device (120) and a thermally conductive device (140). The carbon nanotube material conducts heat from the integrated circuit device (120) to the thermally conductive device (140).</p>
申请公布号 WO2006048848(A1) 申请公布日期 2006.05.11
申请号 WO2005IB53627 申请日期 2005.11.04
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V.;WYLAND, CHRIS;THOONEN, HENDRIKUS, JOHANNES, JOCABUS 发明人 WYLAND, CHRIS;THOONEN, HENDRIKUS, JOHANNES, JOCABUS
分类号 H01L23/373 主分类号 H01L23/373
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