发明名称 |
Thermal and mechanical mounting of an electronic circuit board has heat sink mounted in aperture in circuit board |
摘要 |
<p>The heat generating electronic component [2] is held against the surface of a heat energy dissipating metal heat sink [10] that has a series of fins [13]. The component locates in a hole in an electronic circuit board [8] and is held in position by spring clips [6] for mounting and contact with the circuit board is provided by contact clips [5].</p> |
申请公布号 |
DE102005012147(A1) |
申请公布日期 |
2006.05.11 |
申请号 |
DE20051012147 |
申请日期 |
2005.03.16 |
申请人 |
SIEMENS AG |
发明人 |
BAUDELOT, ERIC;HOFMANN, LARS;LEIBOLD, HERBERT |
分类号 |
H05K7/20;H05K1/18 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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