发明名称 Thermal and mechanical mounting of an electronic circuit board has heat sink mounted in aperture in circuit board
摘要 <p>The heat generating electronic component [2] is held against the surface of a heat energy dissipating metal heat sink [10] that has a series of fins [13]. The component locates in a hole in an electronic circuit board [8] and is held in position by spring clips [6] for mounting and contact with the circuit board is provided by contact clips [5].</p>
申请公布号 DE102005012147(A1) 申请公布日期 2006.05.11
申请号 DE20051012147 申请日期 2005.03.16
申请人 SIEMENS AG 发明人 BAUDELOT, ERIC;HOFMANN, LARS;LEIBOLD, HERBERT
分类号 H05K7/20;H05K1/18 主分类号 H05K7/20
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